Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. - Joeri De Vos; Lan Peng; Alain Phommahaxay; Joost Van Ongeval; Andy Miller; Eric Beyne; Florian Kurz; Thomas Wagenleiter; Markus Wimplinger; Thomas Uhrmann (3DIC, 2016)

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects. - Pengfei Xu; Chiara Marchese; Guy Lepage; Negin Golshani; Ruben Van Eenaeme; Andrea Mingardi; Joost Van Ongeval; Rafal Magdziak; Luc Halipre; Darko Trivkovic; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)