Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy. - Eva Grünwald; Jördis Rosc; René Hammer; Peter Czurratis; Matthias Koch; Jochen Kraft; Franz Schrank; Roland Brunner (Microelectron. Reliab., 2016)

Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. - Julien Magnien; Lisa Mitterhuber; Jördis Rosc; Franz Schrank; Stefan Hörth; Lena Goullon; Matthias Hutter; Stefan Defregger; Elke Kraker (Microelectron. Reliab., 2017)

Metallization defect detection in 3D integrated components using scanning acoustic microscopy and acoustic simulations. - Eva Kozic; René Hammer; Jördis Rosc; Bernhard Sartory; Joerg Siegert; Franz Schrank; Roland Brunner (Microelectron. Reliab., 2018)

Parameter driven monitoring for a flip-chip LED module under power cycling condition. - Julien Magnien; Lisa Mitterhuber; Jördis Rosc; Franz Schrank; Stefan Hörth; Matthias Hutter; Stefan Defregger; Elke Kraker (Microelectron. Reliab., 2018)

Thermal transient measurement and modelling of a power cycled flip-chip LED module. - Lisa Mitterhuber; Stefan Defregger; Julien Magnien; Jördis Rosc; René Hammer; Lena Goullon; Matthias Hutter; Franz Schrank; Stefan Hörth; Elke Kraker (Microelectron. Reliab., 2018)