Jörg Bauer

Affiliations:
  • Fraunhofer Institut Zuverlässigkeit und Mikrointegration, Berlin, Germany


According to our database1, Jörg Bauer authored at least 6 papers between 2008 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Links

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Bibliography

2015
From fan-out wafer to fan-out panel level packaging.
Proceedings of the European Conference on Circuit Theory and Design, 2015

2013
Transport of moisture at epoxy-SiO<sub>2</sub> interfaces investigated by molecular modeling.
Microelectron. Reliab., 2013

2012
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination.
Microelectron. Reliab., 2012

2011
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO<sub>2</sub> interface using molecular modelling.
Microelectron. Reliab., 2011

2010
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.
Microelectron. Reliab., 2010

2008
Lamination And Microstructuring Technology for a Bio-Cell Multiwell array
CoRR, 2008


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