Lamination And Microstructuring Technology for a Bio-Cell Multiwell array - Erik Jung; Dionysios Manessis; Alexander Neumann 002; Lars Böttcher; Tanja Braun; Jörg Bauer 002; Herbert Reichl; Bruno Iafelice; Federica Destro; Roberto Gambari (CoRR, 2008)

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. - Bernhard Wunderle; E. Dermitzaki; O. Hölck; Jörg Bauer 002; Hans Walter; Q. Shaik; K. Rätzke; Franz Faupel; Bernd Michel; Herbert Reichl (Microelectron. Reliab., 2010)

Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling. - O. Hölck; E. Dermitzaki; Bernhard Wunderle; Jörg Bauer 002; Bernd Michel (Microelectron. Reliab., 2011)

Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. - O. Hölck; Jörg Bauer 002; Olaf Wittler; Bernd Michel; Bernhard Wunderle (Microelectron. Reliab., 2012)

Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling. - O. Hölck; Jörg Bauer 002; Tanja Braun; Hans Walter; Olaf Wittler; Bernhard Wunderle; Klaus-Dieter Lang (Microelectron. Reliab., 2013)

From fan-out wafer to fan-out panel level packaging. - Tanja Braun; K.-F. Becker; S. Raatz; V. Bader; Jörg Bauer 002; Rolf Aschenbrenner; S. Voges; Tina Thomas; Ruben Kahle; Klaus-Dieter Lang (ECCTD, 2015)