Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface. - Markus P. K. Turunen; Pekka Marjamäki; Matti Paajanen; Jouko Lahtinen; Jorma K. Kivilahti (Microelectron. Reliab., 2004)

Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate. - Tuomas F. Waris; Markus P. K. Turunen; Tomi Laurila; Jorma K. Kivilahti (Microelectron. Reliab., 2005)

Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards. - Marika P. Immonen; Mikko Karppinen; Jorma K. Kivilahti (Microelectron. Reliab., 2007)

Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. - Tomi Laurila; Toni T. Mattila; Vesa Vuorinen; Juha Karppinen; Jue Li; Mika Sippola; Jorma K. Kivilahti (Microelectron. Reliab., 2007)

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers. - Tomi Laurila; J. Hurtig; Vesa Vuorinen; Jorma K. Kivilahti (Microelectron. Reliab., 2009)

A novel impact test system for more efficient reliability testing. - Jussi Hokka; Toni T. Mattila; Jue Li; Jarmo Teeri; Jorma K. Kivilahti (Microelectron. Reliab., 2010)

On the effects of temperature on the drop reliability of electronic component boards. - Toni T. Mattila; Jue Li; Jorma K. Kivilahti (Microelectron. Reliab., 2012)