Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC. - Ladislav Andricek; Michael Beimforde; Armin Klumpp; Anna Macchiolo; Karl-Reinhard Merkel; Hans-Günther Moser; Richard Nisius; Rainer Helmut Richter; Josef Weber; Philipp Weigell; Robert Wieland (3DIC, 2010)

3D Integration technology: Status and application development. - Peter Ramm; Armin Klumpp; Josef Weber; Nicolas Lietaer; Maaike Taklo; Walter De Raedt; Thomas Fritzsch; Pascal Couderc (ESSCIRC, 2010)

Current and future 3D activities at Fraunhofer. - Andy Heinig; Muhammad Waqas Chaudhary; Peter Schneider; Peter Ramm; Josef Weber (3DIC, 2015)

3D TSV based high frequency components for RF IC and RF MEMS applications. - Montserrat Fernandez-Bolaños; Wolfgang A. Vitale; Mariazel Maqueda Lopez; Adrian M. Ionescu; Armin Klumpp; Karl-Reinhard Merkel; Josef Weber; Peter Ramm; Ilja Ocket; Walter De Raedt; Amin Enayati (3DIC, 2016)

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. - Peter Ramm; Armin Klumpp; Christof Landesberger; Josef Weber; Andy Heinig; Peter Schneider; Günter Elst; Manfred Engelhardt (3DIC, 2019)