Electrical characterization of polymeric insulation by electrically stimulated acoustic wave measurements. - Joseph B. Bernstein (1990)

Laser formed connections for programmable wiring. - Joseph B. Bernstein; Wei Zhang; Carl H. Nicholas (CICC, 1998)

Reliable Laser Programmable Gate Array Technology. - Zhuo Gao; Ji Luo 003; Hu Huang 001; Wei Zhang; Joseph B. Bernstein (ISQED, 2002)

Combined Channel Segmentation and Buffer Insertion for Routability and Performance Improvement of Field. - Hu Huang 001; Joseph B. Bernstein; Martin Peckerar; Ji Luo 003 (ICCD, 2004)

A High Performance Radiation-Hard Field Programmable Analog Array . - Ji Luo 003; Joseph B. Bernstein; J. Ari Tuchman; Hu Huang 001; Kuan-Jung Chung; Anthony L. Wilson (ISQED, 2004)

Deep Submicron CMOS Integrated Circuit Reliability Simulation with SPICE. - Xiaojun Li 001; Bing Huang; J. Qin; X. Zhang; Michael Talmor; Z. Gur; Joseph B. Bernstein (ISQED, 2005)

Simulating and Improving Microelectronic Device Reliability by Scaling Voltage and Temperature. - Xiaojun Li 001; Joerg D. Walter; Joseph B. Bernstein (ISQED, 2005)

Study of the Impact of Hardware Fault on Software Reliability. - Bing Huang; Xiaojun Li 001; Ming Li; Joseph B. Bernstein; Carol S. Smidts (ISSRE, 2005)

Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides. - John S. Suehle; Baozhong Zhu; Yuan Chen; Joseph B. Bernstein (Microelectron. Reliab., 2005)

Electronic circuit reliability modeling. - Joseph B. Bernstein; Moshe Gurfinkel; Xiaojun Li 001; Jörg Walters; Yoram Shapira; Michael Talmor (Microelectron. Reliab., 2006)

Failure rate estimation of known failure mechanisms of electronic packages. - Liyu Yang; Joseph B. Bernstein (Microelectron. Reliab., 2009)

Assessment of acceleration models used for BGA solder joint reliability studies. - Liyu Yang; Joseph B. Bernstein; T. Koschmieder (Microelectron. Reliab., 2009)

Hardware Error Likelihood Induced by the Operation of Software. - Bing Huang; Manuel Rodríguez; Ming Li; Joseph B. Bernstein; Carol S. Smidts (IEEE Trans. Reliab., 2011)

Structural health monitoring of solder joints in QFN package. - I. Gershman; Joseph B. Bernstein (Microelectron. Reliab., 2012)

Reliability matrix solution to multiple mechanism prediction. - Joseph B. Bernstein; Moti Gabbay; Ofir Delly (Microelectron. Reliab., 2014)

Reliability prediction with MTOL. - Joseph B. Bernstein; Alain Bensoussan 002; Emmanuel Bender (Microelectron. Reliab., 2017)

An improved reliability model for Si and GaN power FET. - Gady Golan; Moshe Azoulay; Tsuriel Avraham; Ilan Kremenetsky; Joseph B. Bernstein (Microelectron. Reliab., 2018)

Microchip Health Monitoring System Using the FLL Circuit. - Emmanuel Bender; Joseph B. Bernstein (Sensors, 2021)

The Effects of Process Variations and BTI in Packaged FinFET Devices. - Emmanuel Bender; Joseph B. Bernstein; Duane S. Boning (IRPS, 2023)

The Correct Hot Carrier Degradation Model. - Joseph B. Bernstein; Emmanuel Bender; Alain Bensoussan 002 (IRPS, 2023)