Estimation of warpage and thermal stress of IVHs in flip-chip ball grid arrays package by FEM. - Seunghyun Cho; Soonjin Cho; Joseph Y. Lee (Microelectron. Reliab., 2008)

New dummy design and stiffener on warpage reduction in Ball Grid Array Printed Circuit Board. - Seunghyun Cho; Tae-Eun Chang; Joseph Y. Lee; Hyung-Pil Park; Youngbae Ko; GyunMyoung Park (Microelectron. Reliab., 2010)