3D-enabled customizable embedded computer (3DECC). - Paul D. Franzon; Eric Rotenberg; James Tuck 001; Huiyang Zhou; W. Rhett Davis; Hongwen Dai; Joonmoo Huh; Sungkwan Ku; Steve Lipa; Chao Li 004; Jong Beom Park; Joshua Schabel (3DIC, 2014)

Computing in 3D. - Paul D. Franzon; Eric Rotenberg; James Tuck 001; W. Rhett Davis; Huiyang Zhou; Joshua Schabel; Zhenqian Zhang; J. Brandon Dwiel; Elliott Forbes; Joonmoo Huh; Marcus Tshibangu; Steve Lipa (3DIC, 2015)

Computing in 3D. - Paul D. Franzon; Eric Rotenberg; James Tuck 001; W. Rhett Davis; Huiyang Zhou; Joshua Schabel; Zhenqian Zhang; J. Brandon Dwiel; Elliott Forbes; Joonmoo Huh; Steve Lipa (CICC, 2015)

Physical design of a 3D-stacked heterogeneous multi-core processor. - Randy Widialaksono; Rangeen Basu Roy Chowdhury; Zhenqian Zhang; Joshua Schabel; Steve Lipa; Eric Rotenberg; W. Rhett Davis; Paul D. Franzon (3DIC, 2016)

Processor-in-memory support for artificial neural networks. - Joshua Schabel; Lee Baker; Sumon Dey; Weifu Li; Paul D. Franzon (ICRC, 2016)

H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor. - Vinesh Srinivasan; Rangeen Basu Roy Chowdhury; Elliott Forbes; Randy Widialaksono; Zhenqian Zhang; Joshua Schabel; Sungkwan Ku; Steve Lipa; Eric Rotenberg; W. Rhett Davis; Paul D. Franzon (ICCD, 2017)

Exploring the Tradeoffs of Application-Specific Processing. - Joshua Schabel; Paul D. Franzon (IEEE J. Emerg. Sel. Topics Circuits Syst., 2018)

A Scalable Cluster-based Hierarchical Hardware Accelerator for a Cortically Inspired Algorithm. - Sumon Dey; Lee Baker; Joshua Schabel; Weifu Li; Paul D. Franzon (ACM J. Emerg. Technol. Comput. Syst., 2021)

Hardware Implementation of Hierarchical Temporal Memory Algorithm. - Weifu Li; Paul D. Franzon; Sumon Dey; Joshua Schabel (ACM J. Emerg. Technol. Comput. Syst., 2022)

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. - Theodros Nigussie; Joshua Schabel; Steve Lipa; Lisa G. McIlrath; Robert Patti; Paul D. Franzon (IEEE Trans. Very Large Scale Integr. Syst., 2022)