Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB. - Joungho Kim; Junso Pak; Jongbae Park; Hyungsoo Kim (ISCAS (6), 2005)

Modeling and Measurement of Mode-Conversion and Frequency Dependent Loss in High-Speed Differential Interconnections on Multilayer PCB. - Seungyong Baek; Jingook Kim; Joungho Kim (IEICE Trans. Electron., 2005)

Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. - Dong Gun Kam; Joungho Kim; Jiheon Yu; Ho Choi; Kicheol Bae; Choonheung Lee (IEEE Des. Test Comput., 2006)

Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB. - Junso Pak; Masahiro Aoyagi; Katsuya Kikuchi; Joungho Kim (IEICE Trans. Electron., 2006)

Chip-package hybrid clock distribution network and DLL for low jitter clock delivery. - Daehyun Chung; Chunghyun Ryu; Hyungsoo Kim; Choonheung Lee; Jinhan Kim; Kicheol Bae; Jiheon Yu; Hoi-Jun Yoo; Joungho Kim (IEEE J. Solid State Circuits, 2006)

Design of a Low-Noise UWB Transceiver SiP. - Changwook Yoon; Junwoo Lee; Young-Jin Park; Hyunjeong Park; Jaemin Kim; Junso Pak; Joungho Kim (IEEE Des. Test Comput., 2008)

Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network. - Hyunjeong Park; Hyungsoo Kim; Junso Pak; Changwook Yoon; Kyoungchoul Koo; Joungho Kim (IEICE Trans. Electron., 2008)

A Delay Line Circuit Design for Crosstalk Minimization Using Genetic Algorithm. - Chaeho Chung; Soobum Lee; Byung Man Kwak; Gawon Kim; Joungho Kim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2008)

Frequency-Dependent Transmission Line Model of a Stranded Coaxial Cable. - Jiseong Kim; Eakhwan Song; Jeonghyeon Cho; Yujeong Shim; Gawon Kim; Joungho Kim (IEICE Trans. Electron., 2010)

Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. - Chang Liu 034; Taigon Song; Jonghyun Cho; Joohee Kim; Joungho Kim; Sung Kyu Lim (DAC, 2011)

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. - Taigon Song; Chang Liu 034; Dae Hyun Kim 004; Sung Kyu Lim; Jonghyun Cho; Joohee Kim; Junso Pak; Seungyoung Ahn; Joungho Kim; Kihyun Yoon (ISQED, 2011)

3D-MAPS: 3D Massively parallel processor with stacked memory. - Dae Hyun Kim 004; Krit Athikulwongse; Michael B. Healy; Mohammad M. Hossain; Moongon Jung; Ilya Khorosh; Gokul Kumar; Young-Joon Lee; Dean L. Lewis; Tzu-Wei Lin; Chang Liu 034; Shreepad Panth; et al. (ISSCC, 2012)

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. - Jonghyun Cho; Youngwoo Kim; Joungho Kim; Venky Sundaram; Rao R. Tummala (3DIC, 2013)

Fault isolation of short defect in through silicon via (TSV) based 3D-IC. - Daniel H. Jung; Jonghyun Cho; Heegon Kim; Jonghoon J. Kim; Hongseok Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (3DIC, 2013)

Eye-diagram simulation and analysis of a high-speed TSV-based channel. - Heegon Kim; Jonghyun Cho; Jonghoon J. Kim; Daniel H. Jung; Sumin Choi; Joungho Kim; Junho Lee; Kunwoo Park (3DIC, 2013)

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (3DIC, 2013)

Signal integrity modeling and measurement of TSV in 3D IC. - Joohee Kim; Joungho Kim (ASP-DAC, 2013)

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. - Bumhee Bae; Sunkyu Kong; Jonghoon J. Kim; Sukjin Kim; Joungho Kim (EMC Compo, 2013)

Modeling and analysis of open defect in through silicon via (TSV) channel. - Daniel H. Jung; Heegon Kim; Jonghoon J. Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (EMC Compo, 2013)

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. - Heegon Kim; Jonghyun Cho; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; Joungho Kim; Junho Lee; Kunwoo Park (EMC Compo, 2013)

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. - Jonghoon J. Kim; Heegon Kim; Sukjin Kim; Bumhee Bae; Daniel H. Jung; Sunkyu Kong; Joungho Kim; Junho Lee; Kunwoo Park (EMC Compo, 2013)

Signal integrity design of TSV and interposer in 3D-IC. - Jonghyun Cho; Joungho Kim (LASCAS, 2013)

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System. - Jiseong Kim; Jonghoon J. Kim; Sunkyu Kong; Hongseok Kim; In-Soo Suh; Nam Pyo Suh; Dong-Ho Cho; Joungho Kim; Seungyoung Ahn (Proc. IEEE, 2013)

Fault detection and isolation of multiple defects in through silicon via (TSV) channel. - Daniel H. Jung; Heegon Kim; Jonghoon J. Kim; Sukjin Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (3DIC, 2014)

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. - Jonghoon J. Kim; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung; Joungho Kim (3DIC, 2014)

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. - Youngwoo Kim; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Joungho Kim; Srikrishna Sitaraman; Venky Sundaram; Rao R. Tummala (3DIC, 2014)

Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System. - Yangbae Chun; Seongwook Park; Jonghoon J. Kim; Jiseong Kim; Hongseok Kim; Joungho Kim; Nam Kim; Seungyoung Ahn (IEICE Trans. Commun., 2014)

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. - Sumin Choi; Heegon Kim; Daniel H. Jung; Jonghoon J. Kim; Jaemin Lim; Hyunsuk Lee; Kyungjun Cho; Joungho Kim; Hyungsoo Kim; Yong-Ju Kim; Yunsaing Kim (3DIC, 2015)

Noise coupling modeling and analysis of through glass via(TGV). - Insu Hwang; Jihye Kim; Youngwoo Kim; Jonghyun Cho; Joungho Kim (3DIC, 2015)

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. - Daniel H. Jung; Heegon Kim; Jonghoon J. Kim; Sukjin Kim; Joungho Kim; Hyun-Cheol Bae; Kwang-Seong Choi (3DIC, 2015)

Active Si interposer for 3D IC integrations. - Joungho Kim (3DIC, 2015)

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. - Hyunsuk Lee; Kyungjun Cho; Heegon Kim; Sumin Choi; Jaemin Lim; Joungho Kim (3DIC, 2015)

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. - Jonghoon J. Kim; Daniel H. Jung; Heegon Kim; Sunkyu Kong; Sumin Choi; Jaemin Lim; Joungho Kim (EMC Compo, 2015)

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. - Jaemin Lim; Manho Lee; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; Hyunsuk Lee; Joungho Kim (EMC Compo, 2015)

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). - Daehyun Kim 004; Krit Athikulwongse; Michael B. Healy; Mohammad M. Hossain; Moongon Jung; Ilya Khorosh; Gokul Kumar; Young-Joon Lee; Dean L. Lewis; Tzu-Wei Lin; Chang Liu 034; Shreepad Panth; et al. (IEEE Trans. Computers, 2015)

Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC. - Subin Kim; Youngwoo Kim; Kyungjun Cho; Jinwook Song; Joungho Kim (3DIC, 2016)

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. - Manho Lee; Daniel H. Jung; Heegon Kim; Jonghyun Cho; Joungho Kim (IEEE Des. Test, 2016)

Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems. - Sung Joo Park; Bumhee Bae; Joungho Kim; Madhavan Swaminathan (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Miniaturized and high-performance RF packages with ultra-thin glass substrates. - Min Suk Kim; Markondeya Raj Pulugurtha; Youngwoo Kim; Gapyeol Park; Kyungjun Cho; Vanessa Smet; Venky Sundaram; Joungho Kim; Rao R. Tummala (Microelectron. J., 2018)

Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s. - Yeseul Jeon; Heegon Kim; Joungho Kim; Minkyu Je (IEEE Trans. Circuits Syst. I Regul. Pap., 2018)

High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications. - Min-Woo Kim; Ji H. Kim; Yeonje Cho; Minsik Kim 004; Bo H. Choi; Kwyro Lee; Joungho Kim; Gyu-Hyeong Cho; Chun T. Rim (IEEE Trans. Ind. Electron., 2018)

EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field. - Chiuk Song; Hongseok Kim; Youngwoo Kim; Donghyun Kim 004; Seungtaek Jeong; Yeonje Cho; Seongsoo Lee; Seungyoung Ahn; Joungho Kim (IEEE Trans. Ind. Electron., 2018)

Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material. - Seungtaek Jeong; Donghyun Kim 004; Jinwook Song; Hongseok Kim; Seongsoo Lee; Chiuk Song; Jaehak Lee; Junyeop Song; Joungho Kim (IEEE Trans. Ind. Electron., 2019)

Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System. - Seongsoo Lee; Donghyun Kim 004; Yeonje Cho; Hongseok Kim; Chiuk Song; Seungtaek Jeong; Jinwook Song; Gyeyoung Park; Seokwoo Hong; Junyong Park; Kyungjun Cho; Hyunsuk Lee; et al. (IEEE Trans. Ind. Electron., 2019)

Learning Collaborative Policies to Solve NP-hard Routing Problems. - Minsu Kim 004; Jinkyoo Park; Joungho Kim (NeurIPS, 2021)

Transformer Network-based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM). - HyunWook Park; Minsu Kim 004; Seongguk Kim; Keunwoo Kim; Haeyeon Kim; Taein Shin; Keeyoung Son; Boogyo Sim; Subin Kim; Seungtaek Jeong; Chulsoon Hwang; Joungho Kim (CoRR, 2022)

Collaborative Distillation Meta Learning for Simulation Intensive Hardware Design. - Haeyeon Kim; Minsu Kim 004; Joungho Kim; Jinkyoo Park (CoRR, 2022)

DevFormer: A Symmetric Transformer for Context-Aware Device Placement. - Haeyeon Kim; Minsu Kim 004; Federico Berto; Joungho Kim; Jinkyoo Park (ICML, 2023)

Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect. - Jiwon Yoon; Hyunwoo Kim; Boogyo Sim; Hyunwook Park; Yi-Gyeong Kim; Sujin Park; Youngsu Kwon; Joungho Kim (ISOCC, 2023)

RL4CO: an Extensive Reinforcement Learning for Combinatorial Optimization Benchmark. - Federico Berto; Chuanbo Hua; Junyoung Park 002; Minsu Kim 004; Hyeonah Kim; Jiwoo Son; Haeyeon Kim; Joungho Kim; Jinkyoo Park (CoRR, 2023)