Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. - Xuefen Ong; Soon Wee Ho; Yue Ying Ong; Leong Ching Wai; Kripesh Vaidyanathan; Yeow Kheng Lim; David Yeo; Kai Chong Chan; Juan Boon Tan; Dong Kyun Sohn; Liang Choo Hsia; Zhong Chen 004 (Microelectron. Reliab., 2009)

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. - Yue Ying Ong; Soon Wee Ho; Kripesh Vaidyanathan; Vasarla Nagendra Sekhar; Ming Chinq Jong; Samuel Lim Yak Long; Vincent Lee Wen Sheng; Leong Ching Wai; Vempati Srinivasa Rao; Jimmy Ong; Xuefen Ong; Xiaowu Zhang; et al. (Microelectron. Reliab., 2010)

3D Geometric Engineering of the Double Wedge-Like Electrodes for Filament-Type RRAM Device Performance Improvement. - Jianxun Sun; Yuan Bo Li; Yiyang Ye; Jun Zhang 055; Gang Yih Chong; Juan Boon Tan; Zhen Liu 013; Tupei Chen (IEEE Access, 2020)

Insights on Inter-metal Reliability Assessment of High Voltage Interconnects. - Kwang Sing Yew; Ran Xing Ong; Hin Kiong Yap; Wanbing Yi; Jacquelyn Phang; R. Chockalingam; Juan Boon Tan (IRPS, 2022)