A blister-test apparatus for studies on the adhesion of materials used for neural electrodes. - Juan S. Ordonez; Christian Böhler; Martin Schuettler; Thomas Stieglitz (EMBC, 2011)

Ensuring minimal humidity levels in hermetic implant housings. - Martin Schuettler; Andreas Schatz; Juan S. Ordonez; Thomas Stieglitz (EMBC, 2011)

Improved polyimide thin-film electrodes for neural implants. - Juan S. Ordonez; Christian Böhler; Martin Schuettler; Thomas Stieglitz (EMBC, 2012)

Hermetic glass soldered micro-packages for a vision prosthesis. - Juan S. Ordonez; Philip Dautel; Martin Schuettler; Thomas Stieglitz (EMBC, 2012)

A 232-channel retinal vision prosthesis with a miniaturized hermetic package. - Juan S. Ordonez; Martin Schuettler; Maurits Ortmanns; Thomas Stieglitz (EMBC, 2012)

Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication. - Martin Schuettler; Fabian Kohler; Juan S. Ordonez; Thomas Stieglitz (EMBC, 2012)

A polymer-metal two step sealing concept for hermetic neural implant packages. - Fabian Kohler; Patrick Kiele; Juan S. Ordonez; Thomas Stieglitz; Martin Schuettler (EMBC, 2014)

Cuff electrodes for very small diameter nerves - Prototyping and first recordings in vivo. - Juan S. Ordonez; Victor Pikov; Harvey Wiggins; Craig Patten; Thomas Stieglitz; J. Rickert; Martin Schuettler (EMBC, 2014)

Non-hermetic encapsulation for implantable electronic devices based on epoxy. - Fabian Boeser; Juan S. Ordonez; Martin Schuettler; Thomas Stieglitz; Dennis T. T. Plachta (EMBC, 2015)

Development of a multichannel implantable connector. - Julia Koch; Juan S. Ordonez; Thomas Stieglitz; Martin Schuettler (EMBC, 2015)

Mechanical deformation of thin film platinum under electrical stimulation. - Juan S. Ordonez; Linda Rudmann; Paul Cvancara; Christian Bentler; Thomas Stieglitz (EMBC, 2015)

Hybrid multimodal Deep Brain probe (DBS array) for advanced brain research. - D. Ashouri Vajari; Juan S. Ordonez; L. Furlanetti; M. Dobrossy; Volker A. Coenen; Thomas Stieglitz (NER, 2015)

Dual-sided process with graded interfaces for adhering underfill and globtop materials to microelectrode arrays. - Sharif Khan; Juan S. Ordonez; Thomas Stieglitz (NER, 2017)

Mechanical deformation and chemical degradation of thin-film platinum under aging and electrical stimulation. - Jennifer Pfau; Thomas Stieglitz; Juan S. Ordonez (NER, 2017)

Improved long-term stability of thin-film glassy carbon electrodes through the use of silicon carbide and amorphous carbon. - Maria Vomero; Elisa Castagnola; Juan S. Ordonez; Stefano Carli; Elena Zucchini; Emma Maggiolini; Calogero Gueli; Noah Goshi; Luciano Fadiga; Davide Ricci; Sam Kassegne; Thomas Stieglitz (NER, 2017)

Let There Be Light - Optoprobes for Neural Implants. - Marie T. Alt; Eva Fiedler; Linda Rudmann; Juan S. Ordonez; Patrick Ruther; Thomas Stieglitz (Proc. IEEE, 2017)

Concept and Development of an Electronic Framework Intended for Electrode and Surrounding Environment Characterization In Vivo. - Stefan B. Rieger; Jennifer Pfau; Thomas Stieglitz; Maria Asplund; Juan S. Ordonez (Sensors, 2017)

PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical Devices. - Sharif Khan; Daniel Scholz 002; Juan S. Ordonez; Thomas Stieglitz (EMBC, 2018)