Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. - Tomi Laurila; Toni T. Mattila; Vesa Vuorinen; Juha Karppinen; Jue Li; Mika Sippola; Jorma K. Kivilahti (Microelectron. Reliab., 2007)

Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment. - Juha Karppinen; Jue Li; Toni T. Mattila; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2010)

Shock impact reliability characterization of a handheld product in accelerated tests and use environment. - Juha Karppinen; Jue Li; J. Pakarinen; Toni T. Mattila; Mervi Paulasto-Kröckel (Microelectron. Reliab., 2012)

Maritime Multi-Hop Communication Over 5G Networks: A Maritime Testbed Implementation and Evaluation. - Seppo Horsmanheimo; Lotta Tuomimäki; Andrea Gentili; Matias Varonen; Sami Ruponen; Kimmo Ahola; Johan Scholliers; Jose Costa; Mika Skarp; Marko Ojennus; Atro Lehtinen; Juha Karppinen; et al. (EuCNC/6G Summit, 2025)