Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer. - Jui-Chin Chen; John H. Lau; Tzu-Chien Hsu; Chien-Chou Chen; Pei-Jer Tzeng; Po-Chih Chang; Chun-Hsien Chien; Yiu-Hsiang Chang; Shang-Chun Chen; Yu-Chen Hsin; Sue-Chen Liao; Cha-Hsin Lin; et al. (3DIC, 2013)