TSV fault-tolerant mechanisms with application to 3D clock networks. - Chiao-Ling Lung; Jui-Hung Chien; Yiyu Shi 001; Shih-Chieh Chang (ISOCC, 2011)

On the futility of thermal through-silicon-vias. - Chung-Han Chou; Nien-Yu Tsai; Hao Yu 001; Yiyu Shi 001; Jui-Hung Chien; Shih-Chieh Chang (VLSI-DAT, 2013)

Contactless Stacked-die Testing for Pre-bond Interposers. - Jui-Hung Chien; Ruei-Siang Hsu; Hsueh-Ju Lin; Ka-Yi Yeh; Shih-Chieh Chang (DAC, 2014)

Package geometric aware thermal analysis by infrared-radiation thermal images. - Jui-Hung Chien; Hao Yu; Ruei-Siang Hsu; Hsueh-Ju Lin; Shih-Chieh Chang (DATE, 2014)