A 6-Gb/s Wireless Inter-Chip Data Link Using 43-GHz Transceivers and Bond-Wire Antennas. - Wu-Hsin Chen; Sanghoon Joo; Serkan Sayilir; Russell Willmot; Tae-Young Choi; Dowon Kim; Julia Hsin-Lin Lu; Dimitrios Peroulis; Byunghoo Jung (IEEE J. Solid State Circuits, 2009)

Implementing wireless communication links in 3-D ICs utilizing wide-band on-chip meandering microbump antenna. - Julia Hsin-Lin Lu; Wing-Fai Loke; Dimitrios Peroulis; Byunghoo Jung (3DIC, 2013)

A 1.2 V 2.64 GS/s 8bit 39 mW skew-tolerant time-interleaved SAR ADC in 40 nm digital LP CMOS for 60 GHz WLAN. - Sandipan Kundu; Julia Hsin-Lin Lu; Erkan Alpman; Hasnain Lakdawala; Jeyanandh Paramesh; Byunghoo Jung; Sarit Zur; Eshel Gordon (CICC, 2014)

Millimeter-Wave Wireless Interconnect for 3-D SIC Testing. - Julia Hsin-Lin Lu; Wing-Fai Loke; Byunghoo Jung (IEEE Des. Test, 2014)

A 1.2 V 2.64 GS/s 8 bit 39 mW Skew-Tolerant Time-interleaved SAR ADC in 40 nm Digital LP CMOS for 60 GHz WLAN. - Sandipan Kundu; Erkan Alpman; Julia Hsin-Lin Lu; Hasnain Lakdawala; Jeyanandh Paramesh; Byunghoo Jung; Sarit Zur; Eshel Gordon (IEEE Trans. Circuits Syst. I Regul. Pap., 2015)