Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. - Lionel Cadix; Alexis Farcy; Cédric Bermond; Christine Fuchs; Patrick Leduc; Maxime Rousseau; Myriam Assous; Alexandre Valentian; Julie Roullard; Elie Eid; Nicolas Sillon; Bernard Fléchet; et al. (3DIC, 2009)

Influence of 3D integration on 2D interconnections and 2D self inductors HF properties. - Julie Roullard; Stéphane Capraro; Thierry Lacrevaz; Lionel Cadix; Elie Eid; Alexis Farcy; Bernard Fléchet (3DIC, 2009)