Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints. - Anil Kunwar; Shengyan Shang; Peter Råback; Yunpeng Wang; Julien Givernaud; Jun Chen; Haitao Ma; Xueguan Song; Ning Zhao (Microelectron. Reliab., 2018)