Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method. - Jun-Hsien Yeh; Tsung-Nan Tsai (Microelectron. Reliab., 2014)

Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system. - Tsung-Nan Tsai; Jun-Hsien Yeh (J. Intell. Fuzzy Syst., 2015)