Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate. - Peng Wu; Fengze Hou; Cheng Chen; Jun Li 104; Fengman Liu; Jing Zhang; Liqiang Cao; Lixi Wan (Microelectron. Reliab., 2016)

Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application. - Gengxin Tian; Jun Li 104; Xiaofang Liu; Lixi Wan; Liqiang Cao (J. Electron. Test., 2017)

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process. - Meiying Su; Liqiang Cao; Tingyu Lin 004; Feng Chen; Jun Li 104; Cheng Chen; Gengxin Tian (Microelectron. Reliab., 2018)

Si-based system-in-package design with broadband interconnection for E-band applications. - Jiao Chu; Jun Li 104; Yunyan Zhou; Jia Cao; Pengwei Chen; Liqiang Cao (IEICE Electron. Express, 2021)

An optimization method for conformal shielding. - Jian Yuan; Jun Li 104; Jia Cao; Pengwei Chen; Liqiang Cao; Tianchun Ye 001 (IEICE Electron. Express, 2021)

Si-based Ka-band SIW band-pass filter using wafer level manufacturing process. - Hanxiang Zhu; Jun Li 104; Liqiang Cao; Jia Cao; Pengwei Chen (IEICE Electron. Express, 2021)

Design of a Ka-band receiver front end using Si-based system in package. - Hanxiang Zhu; Jun Li 104; Qidong Wang; Liqiang Cao (IEICE Electron. Express, 2021)

Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package. - Ying Chen; Jun Li 104; Fei Ding; Liqiang Cao (IEICE Electron. Express, 2022)

Long-distance and anti-disturbance wireless power transfer based on concentric three-coil resonator and inhomogeneous electromagnetic metamaterials. - Huilin An; Jian Yuan; Jun Li 104; Liqiang Cao (Int. J. Circuit Theory Appl., 2023)