Research on TSV Void Defects Based on Machine Learning. - Shouhong Chen; Huaiqiang Kang; Jun Ma 031; Ling Guo; Xingna Hou (CSAE, 2019)

Message-Passing Receiver Design for Joint Channel Estimation and Data Decoding in Uplink Grant-Free SCMA Systems. - Fan Wei; Wen Chen 001; Yongpeng Wu 001; Jun Ma 031; Theodoros A. Tsiftsis (IEEE Trans. Wirel. Commun., 2019)

Ultra-Narrow-Band Filter Based on High Q Factor in Metallic Nanoslit Arrays. - Ling Guo; Mengran Guo; Hongyan Yang 002; Jun Ma 031; Shouhong Chen (Sensors, 2020)

Mixed-type wafer defect detection based on multi-branch feature enhanced residual module. - Shouhong Chen; Zhentao Huang; Tao Wang; Xingna Hou; Jun Ma 031 (Expert Syst. Appl., 2024)

Wafer map defect recognition based on multi-scale feature fusion and attention spatial pyramid pooling. - Shouhong Chen; Zhentao Huang; Tao Wang; Xingna Hou; Jun Ma 031 (J. Intell. Manuf., 2025)