Shape Measurement of Solder Bumps by Shape-from-Focus Using Varifocal Mirror. - Jun Mitsudo; Akira Ishii (J. Robotics Mechatronics, 2006)

Constant-Magnification Varifocal Mirror and Its Application to Measuring Three-Dimensional (3-D) Shape of Solder Bump. - Akira Ishii; Jun Mitsudo (IEICE Trans. Electron., 2007)

A Study on Stenosis Detection Based on Non-contact Thrill Wave Imaging and Gradient-Boosting Decision Tree. - Takunori Shimazaki; Yoshifumi Kawakubo; Rumi Iwai; Masashi Fukuhara; Hiroki Aono; Jun Mitsudo; Yuhei Hayashi; Shingo Ata; Takeshi Yokoyama; Daisuke Anzai (ISMICT, 2023)