Impacts of Post-Cu CMP Queue Time on Reliability. - Yinghong Zhao; Hokyung Park; Ki-Don Lee; Liangshan Chen; Manisha Sharma; Sugento Huandra; Hanson Mao; Brian Filemyr Smith; Wei Xia; Joonah Yoon; Junehwan Kim; Myungsoo Yeo; et al. (IRPS, 2024)

Impact of Bi-Layer Gate Stack and Thickness on Low Frequency TDDB in FinFET and Planar Devices. - Kartika Chandra Sahoo; Rakesh Ranjan; Ki-Don Lee; Junehwan Jonathan Kim; Robert Moeller; Pavitra Ramadevi Perepa; John A. Frerich; Ju Kwang Kim; Dung Dau; Mukyeng Jung (IRPS, 2025)