Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI. - Younggeun Ji; Jeonghoon Kim; Jungin Kim; Miji Lee; Jaeheon Noh; Taeyoung Jeong; Juhyeon Shin; Junho Kim; Young Heo; Ung Cho; Hyun-Chul Sagong; Junekyun Park; et al. (IRPS, 2018)

A systematic study of gate dielectric TDDB in FinFET technology. - Hyunjin Kim; Minjung Jin; Hyun-Chul Sagong; Jinju Kim; Ukjin Jung; Minhyuck Choi; Junekyun Park; Sangchul Shin; Sangwoo Pae (IRPS, 2018)

Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology. - Hyun-Chul Sagong; Hyunjin Kim; Seungjin Choo; Sungyoung Yoon; Hyewon Shim; Sangsu Ha; Tae-Young Jeong; Minhyeok Choe; Junekyun Park; Sangchul Shin; Sangwoo Pae (IRPS, 2018)

Localized Layout Effect Related Reliability Approach in 8nm FinFETs Technology: From Transistor to Circuit. - Hai Jiang 005; Hyun-Chul Sagong; Jinju Kim; Junekyun Park; Sangchul Shin; Sangwoo Pae (IRPS, 2019)

Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology. - Hai Jiang 005; Hyun-Chul Sagong; Jinju Kim; Hyewon Shim; Yoohwan Kim; Junekyun Park; Taiki Uemura; Yongsung Ji; Taeyoung Jeong; Dongkyun Kwon; Hwasung Rhee; Sangwoo Pae; et al. (IRPS, 2020)

Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction. - Hai Jiang 005; Jinju Kim; Kihyun Choi; Hyewon Shim; Hyunchul Sagong; Junekyun Park; Hwasung Rhee; Euncheol Lee (IRPS, 2021)