Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications. - Byung-Suk Lee; Yong-Ho Ko; Jung-Hwan Bang; Chang-Woo Lee; Sehoon Yoo; Jun-Ki Kim; Jeong-Won Yoon (Microelectron. Reliab., 2017)

Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics. - Kyeonggon Choi; Dong-Youl Yu; Sungdo Ahn; Kyoung-Ho Kim; Jung-Hwan Bang; Yong-Ho Ko (Microelectron. Reliab., 2018)