Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study. - Sandeep Kumar Goel; Saman Adham; Min-Jer Wang; Ji-Jan Chen; Tze-Chiang Huang; Ashok Mehta; Frank Lee 004; Vivek Chickermane; Brion L. Keller; Thomas Valind; Subhasish Mukherjee; Navdeep Sood; et al. (ITC, 2013)

Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process. - Changhyun Lee; Jonghoon Park; Jinho Yoo; Hyungjun Cho; Jungi Choi; Jeongho Cho; Changkun Park (Microelectron. J., 2013)