The improvement of HEIP immunity using STI engineering at DRAM. - Seung Uk Han; Youngyoun Lee; Yongdoo Kim; Jemin Park; Junhee Lim; Satoru Yamada; Hyeongsun Hong; Kyupil Lee; Gyoyoung Jin; Eunseung Jung (Microelectron. Reliab., 2017)

Improvement of GIDL-assisted Erase by using Surrounded BL PAD Structure for VNAND. - Suhwan Lim; Samki Kim; Changhee Lee; Hyeongwon Choi; Nambin Kim; Jaehun Jung; Hanvit Yang; Tae-Hun Kim; Junhee Lim; Daewon Ha; Sunghoi Hur; Jae-hoon Jang; et al. (IMW, 2023)

Mechanical Stress Effects on Dielectric Leakage and Interconnection Integrity in 3D NAND Flash Memory. - Sehoon Lee; Jieun Lee; Sungpil Jang; Sujeong Kim; Choelgyu Kim; Narae Jeong Sae-Jin Kim; Jisoo Kang; Juhee Hong; Dong-Kyu Kim; Junhee Lim; Sejun Park; Seungwan Hong; et al. (VLSI Technology and Circuits, 2024)