Analysis and evaluation of coupling between adjacent TSVs with considering the discharging path. - Yingbo Zhao; Gang Dong; Yintang Yang; Junping Zheng (IEICE Electron. Express, 2015)

Electrical analysis of TSV step change in radius with compensation structure. - Junping Zheng; Gang Dong; Yintang Yang; Yingbo Zhao; Qingyang Fan (IEICE Electron. Express, 2015)

Universal closed-form expressions for the inductance of tapered through silicon vias (T-TSVs) based on vector magnetic potential. - Zheng Mei; Gang Dong; Yintang Yang; Junping Zheng; Yingbo Zhao; Weijun Zhu (IEICE Electron. Express, 2016)

New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs). - Yintang Yang; Junping Zheng; Gang Dong; Yingbo Zhao; Zheng Mei; Weijun Zhu (IEICE Electron. Express, 2016)

Universal closed-form expression based on magnetic flux density for the inductance of Tapered Through-Silicon Vias (T-TSVs). - Zheng Mei; Gang Dong; Yintang Yang; Junping Zheng; Jingrui Chai; Weijun Zhu (Microelectron. J., 2017)

Utilizing Network Pharmacology and Molecular Docking Technology to Explore The Potential Molecular Mechanisms of Xue Fu Zhu Yu Tang In Treating Insomnia. - Junping Zheng; Glenda Z. Doblas (BIC, 2024)