Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB. - Joungho Kim; Junso Pak; Jongbae Park; Hyungsoo Kim (ISCAS (6), 2005)

Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB. - Junso Pak; Masahiro Aoyagi; Katsuya Kikuchi; Joungho Kim (IEICE Trans. Electron., 2006)

Design of a Low-Noise UWB Transceiver SiP. - Changwook Yoon; Junwoo Lee; Young-Jin Park; Hyunjeong Park; Jaemin Kim; Junso Pak; Joungho Kim (IEEE Des. Test Comput., 2008)

Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network. - Hyunjeong Park; Hyungsoo Kim; Junso Pak; Changwook Yoon; Kyoungchoul Koo; Joungho Kim (IEICE Trans. Electron., 2008)

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. - Taigon Song; Chang Liu 034; Dae Hyun Kim 004; Sung Kyu Lim; Jonghyun Cho; Joohee Kim; Junso Pak; Seungyoung Ahn; Joungho Kim; Kihyun Yoon (ISQED, 2011)