Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size. - Markus Thoben; X. Xie; D. Silber; Jürgen Wilde (Microelectron. Reliab., 2001)

Design optimization of an eddy current sensor using the finite-elements method. - Jürgen Wilde; Yuqing Lai (Microelectron. Reliab., 2003)

Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting. - Stefan Martens; B. Krueger; Walter Mack; Friedemann Voelklein; Jürgen Wilde (Microelectron. Reliab., 2008)

Harsh environment application of electronics - Reliability of copper wiring and testability thereof. - Sabrina Rathgeber; R. Bauer; Andreas Otto; Erik Peter; Jürgen Wilde (Microelectron. Reliab., 2012)

Influence of dicing damages on the thermo-mechanical reliability of bare-chip assemblies. - Matthias Steiert; Jürgen Wilde (Microelectron. Reliab., 2014)

Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices. - Adeel Ahmad Bajwa; Jürgen Wilde (Microelectron. Reliab., 2016)