Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies. - T. Kangasvieri; Olli Nousiainen; Jussi Putaala; Risto Rautioaho; J. Vähäkangas (Microelectron. Reliab., 2006)

A prognostic method for the embedded failure monitoring of solder interconnections with 1149.4 test bus architecture. - Juha-Veikko Voutilainen; Jussi Putaala; Markku Moilanen; Heli Jantunen (Microelectron. J., 2009)

Reliability of ICA attachment of SMDs on inkjet-printed substrates. - Juha Niittynen; Janne Kiilunen; Jussi Putaala; Ville Pekkanen; Matti Mäntysalo; Heli Jantunen; Donald Lupo (Microelectron. Reliab., 2012)

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors. - Jussi Putaala; Jari Hannu; Esa Kunnari; Matti Mäntysalo; Olli Nousiainen; Heli Jantunen (Microelectron. Reliab., 2014)

RF measurements to pinpoint defects in inkjet-printed, thermally and mechanically stressed coplanar waveguides. - Sami Myllymäki; Jussi Putaala; Jari Hannu; Esa Kunnari; Matti Mäntysalo (Microelectron. Reliab., 2016)

Dual-polarized 2×2 element sub-array at 15 GHz with high port isolation. - Marko Sonkki; Sami Myllymäki; Jussi Putaala; Maciej Sobocinski; Aarno Pärssinen; Eero Heikkinen; Tomi Haapala; Kari Nikkanen (EuCNC, 2017)