Intrinsic Reliability of BEOL interlayer dielectric. - James Palmer 002; Galor Zhang; Justin R. Weber; Cheyun Lin; Christopher Perini; Rahim Kasim (IRPS, 2021)

Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes. - Rahim Kasim; Cheyun Lin; Christopher Perini; James Palmer 002; N. Gilda; S. Imam; Justin R. Weber; C. Wallace; Jeffery Hicks (IRPS, 2023)

2D Materials in the BEOL. - C. H. Naylor; Kirby Maxey; C. Jezewski; K. P. O'Brien; A. V. Penumatcha; M. S. Kavrik; B. Agrawal; C. V. Littlefield; J. Lux; B. Barley; Justin R. Weber; A. Sen Gupta; et al. (VLSI Technology and Circuits, 2023)