Reliability Challenges from 2.5D to 3DIC in Advanced Package Development. - Ryan Lu; Yao-Chun Chuang; Jyun-Lin Wu; Jun He (IRPS, 2023)

Characterization of Cu and SiCN Adhesion in BEOL Interconnections. - Chang-Fu Han; Jia-Ming Yang; Chia-Hua Chang; Yu-Sheng Lin; Jyun-Lin Wu; Yao-Chun Chuang; Ryan Lu (IRPS, 2025)

CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives. - Ching-Ting Liu; Yao-Chun Chuang; Jyun-Lin Wu; Jia-Shen Lan; Chang-Fu Han; Chia-Hua Chang; Jia-Ming Yang; Yu-Sheng Lin; Chen-Wei Li; Ryan Lu (IRPS, 2025)