Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests. - Jau-Sheng Wang; Chun-Chin Tsai; Jyun-Sian Liou; Wei-Chih Cheng; Shun-Yuan Huang; Gi-Hung Chang; Wood-Hi Cheng (Microelectron. Reliab., 2012)