Study of the self-alignment of no-flow underfill for micro-BGA assembly. - Y. C. Chan; P. L. Tu; K. C. Hung (Microelectron. Reliab., 2001)

Reliability of microBGA assembly using no-flow underfill. - P. L. Tu; Y. C. Chan; K. C. Hung (Microelectron. Reliab., 2001)

Study of micro-BGA solder joint reliability. - P. L. Tu; Y. C. Chan; K. C. Hung; J. K. L. Lai (Microelectron. Reliab., 2001)

Reliability study of the electroless Ni-P layer against solder alloy. - M. O. Alam; Yan Cheong Chan; K. C. Hung (Microelectron. Reliab., 2002)

No-flow underfill flip chip assembly–an experimental and modeling analysis. - Hua Lu 003; K. C. Hung; Stoyan Stoyanov; Chris Bailey 001; Y. C. Chan (Microelectron. Reliab., 2002)

Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. - C. F. Luk; Y. C. Chan; K. C. Hung (Microelectron. Reliab., 2002)

Application of adhesive bonding techniques in hard disk drive head assembly. - C. F. Luk; Y. C. Chan; K. C. Hung (Microelectron. Reliab., 2002)