Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone. - Dau Fatt Lim; K. C. Leong; Chuan Seng Tan (3DIC, 2011)

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. - Chuan Seng Tan; Dau Fatt Lim; Xiao Fang Ang; Jun Wei; K. C. Leong (Microelectron. Reliab., 2012)