Locality Performance of Some Mesh-indexings. - H. K. Dai 001; K. C. Su (PDPTA, 2002)

Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment. - M. H. Lin; Y. L. Lin; K. P. Chang; K. C. Su; Tahui Wang (Microelectron. Reliab., 2005)

Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. - M. H. Lin; K. P. Chang; K. C. Su; Tahui Wang (Microelectron. Reliab., 2007)

Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects. - Clement Huang; Alex Juan; K. C. Su (IRPS, 2020)