Numerical Analysis Of The Edl Effect On Liquid Flow In Microchannels. - X. Y. Chen; C. Yang; K. C. Toh; J. C. Chai (Int. J. Comput. Eng. Sci., 2003)

Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. - T. Y. Lin; K. L. Davison; W. S. Leong; Simon Chua; Y. F. Yao; J. S. Pan; J. W. Chai; K. C. Toh; W. C. Tjiu (Microelectron. Reliab., 2003)