The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. - T. Y. Lin; W. S. Leong; K. H. Chua; R. Oh; Y. Miao; J. S. Pan; J. W. Chai (Microelectron. Reliab., 2002)

Development of the green plastic encapsulation for high density wirebonded leaded packages. - T. Y. Lin; C. M. Fang; Y. F. Yao; K. H. Chua (Microelectron. Reliab., 2003)

Improving the deflection of wire bonds in stacked chip scale package (CSP). - Y. F. Yao; T. Y. Lin; K. H. Chua (Microelectron. Reliab., 2003)

The impact of moisture in mold compound preforms on the warpage of PBGA packages. - T. Y. Lin; B. Njoman; D. Crouthamel; K. H. Chua; S. Y. Teo; Y. Y. Ma (Microelectron. Reliab., 2004)

New encapsulation development for fine pitch IC devices. - Y. F. Yao; B. Njoman; K. H. Chua; T. Y. Lin (Microelectron. Reliab., 2005)

Analysis on the Employability Skills of UNITEN Graduates in Engineering Program. - A. R. Fadhilah; M. N. Noraini; A. M. Noreliza; K. H. Chua (ICEED, 2018)