An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. - K. M. Chen; B. C. Wu; K. H. Tang; F. Y. Cheng; N. H. Kao; J. Y. Lai (Microelectron. Reliab., 2006)

Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers. - K. M. Chen; K. H. Tang; J. S. Liu (Microelectron. Reliab., 2008)

Sub-ns Access Sub-mW/GHz 32 Kb SRAM with 0.45 V Cross-Point-5T Cell and Built-in Y_ Line. - C. Y. He; K. H. Tang; T. S. Chen; K. Y. Chang; C. H. Lin; K. Sato; Shyh-Jye Jou; P. H. Chen; H. M. Chen; B. D. Rong; K. Itoh (A-SSCC, 2019)