Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips. - K. K. Jinka; S. Ganesan; A. Dasgupta; S. Ling; Andrew A. Shapiro; D. Schatzel (Microelectron. Reliab., 2007)

Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires. - K. K. Jinka; A. Dasgupta; S. Ganesan; S. Ling (Microelectron. Reliab., 2009)