Effects of underfill materials on the reliability of low-K flip-chip packaging. - K. M. Chen; D. S. Jiang; N. H. Kao; J. Y. Lai (Microelectron. Reliab., 2006)

An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. - K. M. Chen; B. C. Wu; K. H. Tang; F. Y. Cheng; N. H. Kao; J. Y. Lai (Microelectron. Reliab., 2006)

Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers. - K. M. Chen; K. H. Tang; J. S. Liu (Microelectron. Reliab., 2008)

High speed (1ns) and low voltage (1.5V) demonstration of 8Kb SOT-MRAM array. - M. Y. Song; C. M. Lee; S. Y. Yang; G. L. Chen; K. M. Chen; I J. Wang; Y. C. Hsin; K. T. Chang; C. F. Hsu; S. H. Li; J. H. Wei; T. Y. Lee; et al. (VLSI Technology and Circuits, 2022)