Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints. - J. G. Lee; K. N. Subramanian (Microelectron. Reliab., 2007)

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages. - Yuelin Wu; K. N. Subramanian; Scott Calabrese Barton; Andre Lee (Microelectron. Reliab., 2017)