A Reliability Overview of Intel's 10+ Logic Technology. - Rohit Grover; Tony Acosta; C. AnDyke; Emre Armagan; C. Auth; Sunny Chugh; K. Downes; M. Hattendorf; N. Jack; S. Joshi; R. Kasim; Gerald S. Leatherman; et al. (IRPS, 2020)

Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process. - Cheyun Lin; Uygar E. Avci; M. A. Blount; Rohit Grover; Jeffery Hicks; R. Kasim; A. Kundu; C. M. Pelto; C. Ryder; Anthony Schmitz; K. Sethi; D. Seghete; et al. (IRPS, 2020)

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing. - Walid M. Hafez; P. Agnihotri; M. Asoro; M. Aykol; B. Bains; Rohan Bambery; M. Bapna; A. Barik; A. Chatterjee; P. C. Chiu; T. Chu; C. Firby; et al. (VLSI Technology and Circuits, 2023)