Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. - K. S. Kim; S. H. Huh; K. Suganuma (Microelectron. Reliab., 2003)

Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. - M. Yamashita; K. Suganuma (Microelectron. Reliab., 2006)

Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure. - M. Yamashita; K. Suganuma (Microelectron. Reliab., 2006)

Low-temperature low-pressure die attach with hybrid silver particle paste. - K. Suganuma; S. Sakamoto; N. Kagami; D. Wakuda; K. S. Kim; M. Nogi (Microelectron. Reliab., 2012)