TDX-1: A Distributed System Architecture for High Throughout Telephone Switching. - W. Yu; S. Y. Kang; K. W. Lee (COMPCON, 1987)

Optimal Sizing of Feedforward Neural Networks: Case Studies. - K. W. Lee; H. N. Lam (ANNES, 1995)

Optimising neural network weights using genetic algorithms: a case study. - K. W. Lee; H. N. Lam (ICNN, 1995)

Stochastic models for random-request availability. - K. W. Lee (IEEE Trans. Reliab., 2000)

Roadmap constrained SLAM in neighborhood environment. - Javier Ibañez-Guzmán; W. Sardha Wijesoma; K. W. Lee (ICARCV, 2004)

Joint use of DEA and constrained canonical correlation analysis for efficiency valuations involving categorical variables. - K. S. Park; K. W. Lee; M. S. Park; D. Kim (J. Oper. Res. Soc., 2009)

A random finite set based detection and tracking using 3D LIDAR in dynamic environments. - Bharath Kalyan; K. W. Lee; W. Sardha Wijesoma; Diluka Moratuwage; Nicholas M. Patrikalakis (SMC, 2010)

FISST-SLAM: Finite Set Statistical Approach to Simultaneous Localization and Mapping. - Bharath Kalyan; K. W. Lee; W. Sardha Wijesoma (Int. J. Robotics Res., 2010)

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. - K. W. Lee; Chisato Nagai; Ai Nakamura; Ji Chel Bea; Mariappan Murugesan; Takafumi Fukushima; Tanaka Tanaka; Mitsumasa Koyanagi (3DIC, 2014)

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. - Mariappan Murugesan; Takafumi Fukushima; Ji Chel Bea; K. W. Lee; Mitsu Koyanagi; Y. Imai; S. Kimura; Tetsu Tanaka (3DIC, 2014)

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. - K. W. Lee; Ji Chel Bea; Mitsu Koyanagi; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2015)

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. - K. W. Lee; Chisato Nagai; Ai Nakamura; Hiroki Aizawa; Ji Chel Bea; Mitsumasa Koyanagi; Hideto Hashiguchi; Takafumi Fukushima; Tanaka Tanaka (3DIC, 2015)

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. - Mariappan Murugesan; Jichoel Bea; Hiroyuki Hashimoto; K. W. Lee; Mitsu Koyanagi; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2015)

Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology. - Nam-Hyun Lee; Sunhang Lee; S.-H. Kim; G.-J. Kim; K. W. Lee; Y. S. Lee; Y. C. Hwang; H. S. Kim; S. Pae (IRPS, 2022)

Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC. - S. Lee; N.-H. Lee; K. W. Lee; J. H. Kim; J. H. Jin; Y. S. Lee; Y. C. Hwang; H. S. Kim; S. Pae (IRPS, 2023)

Demonstration of Logic-Block Performance-Power-Area Gain by 1st Generation Back Side Power Delivery Network for SoC and HPC Applications Beyond 2 nm Node. - H. Fukutome; J. Kim; Joonghan Shin; J. Kim; Youngsoo Lee; S. Chae; B. Eom; Y. S. Nam; Minseong Lee; Sanghyun Ha; E. G. Chung; Sung-Hoon Lee; et al. (CICC, 2025)