Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits. - Arief Suriadi Budiman; H.-A.-S. Shin; B.-J. Kim; S.-H. Hwang; Ho-Young Son; Min-Suk Suh; Q.-H. Chung; K.-Y. Byun; Nobumichi Tamura; Martin Kunz; Young-Chang Joo (Microelectron. Reliab., 2012)

3D memory chip stacking by multi-layer self-assembly technology. - Takafumi Fukushima; Jichoel Bea; Mariappan Murugesan; Ho-Young Son; Min-Suk Suh; K.-Y. Byun; N.-S. Kim; Kang Wook Lee 002; Mitsumasa Koyanagi (3DIC, 2013)