Fluid-solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing. - Zhaohui Chen; Qin Zhang; Kai Wang 007; Mingxiang Chen; Sheng Liu (Microelectron. Reliab., 2012)

Research on lumen depreciation related to LED packages by in-situ measurement method. - Quan Chen 005; Xiaobing Luo; Qi Chen; Kai Wang 007; Sheng Liu; Jingyan Li (Microelectron. Reliab., 2015)

Spray coating of polymer electret with nano particles for stable surface charge. - Yixin Xu; Anxin Luo; Ai Zhang; Yulong Zhang 004; Kai Wang 007; Fei Wang 025 (NEMS, 2016)

Recent Advances in the Hardware of Visible Light Communication. - Yilin Zhang; Lu Wang 002; Kai Wang 007; Kam Sing Wong; Kaishun Wu (IEEE Access, 2019)

Up-Conversion Device Based on Quantum Dots With High-Conversion Efficiency Over 6%. - Haodong Tang; Kanming Shi; Nan Zhang; Zuoliang Wen; Xiangtian Xiao; Bing Xu; Haider Butt; Zoe Pikramenou; Kai Wang 007; Xiao Wei Sun (IEEE Access, 2020)