Silicon-interposer with high density Cu-filled TSVs. - Robert Wieland; Kai Zoschke; Nils Jurgensen; Karl-Reinhard Merkel; Lars Nebrich; Jürgen Wolf (3DIC, 2010)

3D integration of standard integrated circuits. - Rene Puschmann; Mathias Bottcher; Irene Bartusseck; Frank Windrich; Conny Fiedler; Peggy John; Charles Alix Manier; Kai Zoschke; Jurgen Grafe; Hermann Oppermann; Jürgen Wolf; K. Dieter Lang; et al. (3DIC, 2013)

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-µW RTC Mode and Programmable HF Clocks. - David Ruffieux; Nicola Scolari; Frédéric Giroud; Thanh-Chau Le; Silvio Dalla Piazza; Felix Staub; Kai Zoschke; Charles Alix Manier; Hermann Oppermann; Tommi Suni; James Dekker; Giorgio Allegato (IEEE J. Solid State Circuits, 2014)

Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster. - Kai Zoschke; Maurice Güttler; Lars Böttcher; Andreas Grübl; Dan Husmann de Oliveira; Johannes Schemmel; Karlheinz Meier; Oswin Ehrmann (CoRR, 2018)

Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies. - Piotr Mackowiak; Samer Al-Magazachi; Klaus-Dieter Lang; Kolja Erbacher; Manuel Bäuscher; Ha-Duong Ngo; Kai Zoschke; Michael Schiffer (DeSE, 2019)