Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs. - Kan Wang 003; Yuchun Ma; Sheqin Dong; Yu Wang 002; Xianlong Hong; Jason Cong (ASP-DAC, 2011)

Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs. - Kan Wang 003; Sheqin Dong; Yuchun Ma; Yu Wang 002; Xianlong Hong; Jason Cong (IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2011)

Multi-Objective Light Ray Optimization. - Kan Wang 003; Jihong Shen (CSO, 2012)

Voltage island-driven power optimization for application specific network-on-chip design. - Kan Wang 003; Sheqin Dong; Satoshi Goto (ACM Great Lakes Symposium on VLSI, 2012)

Leakage-aware performance-driven TSV-planning based on network flow algorithm in 3D ICs. - Kan Wang 003; Sheqin Dong; Yuchun Ma; Satoshi Goto; Jason Cong (ISQED, 2012)

Power optimization for application-specific 3D network-on-chip with multiple supply voltages. - Kan Wang 003; Sheqin Dong (ASP-DAC, 2013)

Escape routing of mixed-pattern signals based on staggered-pin-array PCBs. - Kan Wang 003; Huaxi Wang; Sheqin Dong (ISPD, 2013)

Post-floorplanning power optimization for MSV-driven application specific NoC design. - Kan Wang 003; Sheqin Dong (ISCAS, 2014)

Mixed-Crossing-Avoided Escape Routing of Mixed-Pattern Signals on Staggered-Pin-Array PCBs. - Kan Wang 003; Sheqin Dong; Huaxi Wang; Qian Chen; Tao Lin (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014)